Flip-Chip MEMS Pressure Module
Core Technical Data:
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Assembly Technology: Flip-Chip Bonding (Compact & Robust)
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Pressure Range: 0–1 MPa / 0–10 bar (Customizable)
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Digital Output: I²C / SPI / Sent (Digital Interface)
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Operating Temperature: -40°C to +125°C (Automotive Grade)
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Accuracy (TEB): ±1.0% F.S. Total Error Band
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Media Compatibility: Oil, Air, and Non-corrosive Gases
- Dimensions: Ultra-compact Size (e.g., 6.5 x 6.5 mm)
Reliable Supply. Global Confidence
Why Choose Queen Sensors
100% Genuine Ampron Products: We supply direct from the manufacturer, ensuring fully traceable, brand-new, and authentic sensors.
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Moments Behind the Supply
Committed to Quality
Compliance & Reliability
- IATF 16949 Certified Manufacturing
- Rigorous Quality Control
- International Standard Compliance
- Full Traceability & Authenticity Assurance
Precision is non-negotiable. Every product we supply is backed by strict quality control, certified manufacturing processes, and full traceability to ensure dependable performance in critical applications.